Advanced Phased-Array & Broadband RF Solutions For Next-Generation Sensing, Communications and EW Systems

At Forestown AXMEAS GmbH, we support European engineering teams with access to highly integrated phased-array systems, SiP-based RF front-ends, and broadband RF modules. Our solutions are based on advanced heterogeneous integration, 3D SiP packaging, and modular phased-array architectures, enabling compact size, low profile, and outstanding performance from microwave to mmWave frequencies.

Whether you are building anti-UAS systems, low-altitude surveillance radars, satellite communication terminals, or broadband EW receivers, we provide tailored modules, subsystems, and engineering support to help accelerate your development.

What We Offer

1. Phased Array Antenna Systems & Subsystems

High-performance, low-profile active phased arrays for defense, surveillance, and communication platforms.

Ku-Band 1D Phased Array Modules

• EIRP up to approx. 93 dBm
• Elevation beam scanning up to ±60°
• Optimized for small-target detection and low-altitude surveillance

X-Band 1D Phased Array for Anti-UAS

• EIRP up to approx. 80 dBm
• Azimuth beam scanning up to ±45°
• Low-profile, lightweight construction for easy platform integration

LEO Satellite Communication Flat-Panel Array

• Ka-band receive / K-band transmit operation
• High G/T and EIRP performance for LEO satellite links
• Electronic beam steering up to ±50° with dual circular polarization
• Flat-panel form factor – easy to mount, transport, and deploy

Dual-Band C/L-Band Phased Array for Meteorology & Satcom

• Modular 2D array with thousands of elements
• Simultaneous multi-beam reception of geostationary and polar-orbit satellites
• Designed for weather data reception and mission-critical environmental monitoring

2. Modular Sub-Array Tiles (Integrated T/R)

Ideal for European integrators developing their own phased-array architectures.

Ku-Band 16-Channel Standard Tile

• 4×4 channels, operating from approx. 15–17 GHz
• Integrated antenna and T/R front-end in a compact package
• Beam scanning up to ±60°
• High consistency and small footprint, well suited for scalable array construction

These tiles can be combined to form larger arrays for low-altitude surveillance, anti-UAS solutions, and precision sensing applications.

3. High-Integration SiP RF Front-End Modules

For system integrators developing EW receivers, phased-array radars, or broadband RF instruments, we provide highly integrated SiP front-end modules.

Ka-Band 4-Channel Receiver SiP (32–38 GHz)

• 4-channel receiver module on high-resistivity silicon
• 6-bit digital phase and amplitude control per channel
• Low noise figure and high gain for phased-array TR front-ends
• 3D TSV/RDL-based package for minimum footprint

Ku-Band 4-Channel Ceramic SiP (12–18 GHz)

• 4-channel multi-function receive sub-system
• Integrated limiter, low-noise amplifier, and multi-function control chip
• 6-bit digital phase and amplitude control
• Low noise figure, high integration, low power consumption

2–18 GHz Broadband Receiver SiP

• Wideband RF input from approx. 2–18 GHz
• Dual down-conversion to ~1.8 GHz IF
• Integrated filters, attenuators, mixers, LNAs, and IF chain
• Compact ceramic SiP ideal for EW and spectrum-sensing platforms

4. Reconfigurable Broadband RF Components

Flexible broadband components for test & measurement, EW systems, and cognitive RF research.

Reconfigurable Broadband Filter IC

• Frequency coverage roughly 2–18 GHz
• Digitally tunable center frequency and bandwidth
• Supports low-pass, high-pass, and band-pass modes
• Compact IC alternative to bulky switched filter banks

Reconfigurable GaN Power Amplifier IC (2–18 GHz)

• 0.15 μm GaN technology for wideband high-efficiency operation
• Output power in the 33–34 dBm range across the band
• Good power-added efficiency over multiple sub-bands
• Suitable for broadband transmitters, EW, and test applications

Key Enabling Technologies

• Advanced heterogeneous integration – Combining silicon and compound semiconductor devices in 3D-stacked SiP architectures.
• TSV and RDL interconnects – High-density vertical and planar routing for maximum integration and minimum footprint.
• Low-profile tightly coupled arrays – Enabling wideband operation, high agility, and reduced mass.
• End-to-end capability – From chip and SiP design through module, array, and system-level calibration and testing.

Application Areas

• Low-altitude radar and anti-UAS systems
• Border and critical infrastructure surveillance
• Electronic warfare receivers and ECM systems
• LEO satellite communication terminals
• Broadband RF test & measurement equipment
• Scientific research platforms and technology demonstrators

Work With Forestown AXMEAS GmbH

Forestown AXMEAS GmbH acts as the exclusive technical and commercial interface for these technologies in Europe. We provide:

• Engineering consultation and requirement analysis
• Module selection, customization, and integration guidance
• Local prototype support and coordination within the EU
• Flexible licensing and OEM supply options
• Confidential development frameworks for sensitive projects

If your organisation is working on next-generation sensing, communication, or RF systems, our phased-array and broadband RF solutions can significantly accelerate your development.

Ready to discuss a project?

Contact our engineering team:
Email: info@axmeas.eu
Phone: +49 (0)821 71048957
Forestown AXMEAS GmbH, Apprichstr. 16, 86199 Augsburg, Germany